Mechanic XG-50 Solder Paste

Mechanic XG-50 solder paste is perfect for BGA/micro BGA stencil reball. We have tried many types of solder paste and this is definitely our favourite.

The paste consists of 25-45μm Solder balls, suspended in a non-corrosive, low residue no clean flux, designed specifically for hot air rework.

XG-50 is best stored in a refrigerator at 0-10C, and used at room temperature.

Alloy: Sn63/Pb37 (63% Tin, 37% Lead)