0.25mm Micro BGA Solder Balls (Sn63/Pb37) – 25K

These Solder Balls are ideal for re-balling a range of IC’s in high density devices such as Phones, Tablets, Laptops, and other consumer electronics.
Using Solder Balls rather than paste allows much greater accuracy when reballing IC’s, and allows you to perform a “Manual Reball” on IC’s you do not have a stencil for.
Each container has 25K Balls of Leaded Solder, with a 0.25mm ball size.Please Note: Container style/material may vary depending on stock
Alloy:Sn63/Pb37 (63% Tin, 37% Lead)